Equipment


Ultrashort Pulse Laser system – Optec WS Multihead


Amphos 200

  • IR: 200 W, 1 mJ / VIS: 100 W, 500 µJ
  • 900 fs - 10 ps

Mlase

  • UV: 248 nm, 10 mJ, 500 Hz

5-axis processing

High rate and combined processes

Galvo scanners and fixed optics


Ultrashort Pulse Laser system – Optec MM 200 USP


Light Conversion Pharos

  • IR: 10 W, 200 µJ / VIS: 5,5 W / UV: 3 W
  • 220 fs - 15 ps

3-axis processing

Galvoscanner and fixed optics

Precision machining


Ultrashort Pulse Laser system – GFH Gl.evo


Trumpf TruMicro 5050

  • IR: 40 W, 400 µJ
  • 800 fs

5-axis machining

Helical drilling optics


Ultrashort Pulse Laser system – Pulsar RDX 1000


Amplitude Systems Tangor

  • IR: 100 W, 500 µJ
  • 800 fs

High power liquid crystal light modulator

Dynamic laser beam shaping

Process parallelization


Laser Metal Deposition System – Laservorm LV Midi


4 000 W multi-mode fiber laser

  • Wavelength: 1070 nm
  • 200 µm fiber for welding and hardening

5-axis system

  • Traveling path: 600 x 300 x 300 mm3
  • Swivel unit: B-axis 100°, C-axis 360°
  • Positioning accuracy: < 10 µm

Powder feeder for laser metal depositioning

Camera and pyrometer for process monitoring


Fine Welding & Fine Cutting – Laservorm LV Mini


QCW fiber laser

  • Wavelength: 1070 nm
  • Maximum average power: 300 W
  • Maximum peak power: 3000 W
  • Pulse duration: 0.2 - 50 ms
  • 50 µm fiber for welding and cutting
  • Welding head Focal length: 200 mm
  • Cutting head Focal length: 100 mm

3-axis system

  • Traveling path: 200 x 150 x 150 mm3
  • Positioning accuracy: < 10 µm

Plastic welding machine – Leister NOVOLAS


Fiber Laser YLM-300-AC (IPG)

  • Wavelength: 1070 nm
  • Power: 300 W

Diode laser DLM-300-AC (IPG)

  • Wavelength: 968 nm
  • Power: 300 W

Contour and quasi-simultaneous welding

Beam shaping by diffractive optical elements

Pyrometer monitoring

Pressing appliance

Optional rotation axis


TPA Laser System – OPTEC


Erdium doped ultrashort pulse fiber laser

  • Wavelength = 780 nm; Pulse energy = 160 mW
  • Pulse duration = 100 fs; Repetition rate = 80,1 MHz

Ytterbium doped oscillator

  • Wavelength = 515 nm; Pulse energy = 551 mW
  • Pulse duration = 267 fs; repetition rate = 54,7 MHz

Linear drives x- and y-direction

  • Traveling path: 110 mm
  • Feed rate: up to 350 mm/s

Linear drives in z-direction

  • Traveling path: 50 mm
  • Feed rate: up to 500 mm/s

Complete 3D structure creation


Excimer Laser – OPTEC MicroMaster


Laser sources: ATL Atlex 300 Excimer Laser

  • KrF-Gasmix à Wellenlänge 248 nm
  • Max. Pulse energy 15 mJ
  • Max. Repetition rate 300 Hz

Mask projection on motorized X/Y Stage

  • Positioning accuracy 1 µm
  • Reduction factor adjustable from 4x - 15x
  • Motorized focus optics (Z-Axis)
  • CAD compatible

Typical applications

  • Bulk materials processing for glas, ceramics, metals, polymers
  • Thinfilm structuring
  • Microfluidics
  • Integrated optics
  • Polymer removal

Fiber laser systems


500 W cw single-mode fiber laser

  • M2 < 1.1
  • Modulating up to 50 kHz
  • Focus diameter approx. 14 µm
  • Cutting up to 1 mm (aluminum 200 mm/s)

20 W pulsed fiber laser

  • M2 < 1.6
  • 2 - 80 kHz Pulse frequency
  • 1 mJ Pulse energy
  • 100 ns Pulse duration
  • Marking, drilling, ablating

Aerotech 3 axes linear drives up to 750 mm/s

High dynamic

Fine cutting head with 50 mm focal length

Galvo scanner with 163 mm f-θ lens


Multi-kW laser system


4 000 W multi-mode fiber laser

  • 100 µm fiber for cutting
  • 300 µm fiber for welding

3-axis gantry system (Aerotech)

  • Machining area 1 x 0.5 m2
  • Positioning accuracy < 5 µm

Sensor system for monitoring cutting quality

Cutting performance

  • 10 mm steel at 15 mm/s
  • Up to 30 mm steel possible

Laser engraving system – Trotec Speedy 400


CO2 Laser Iradion Infinity

  • Wavelength: 10.6 µm
  • Power: 80 W

Fiber laser

  • Wavelength: 1070 nm
  • Power: 50 W

Traveling path: 1000 mm x 610 mmx 305 mm

Feed rate: 3.55 m/s

round engravings possible


Water jet guided laser system


Beam source 100 W DPSSL (532 nm)

  • Puls or cw Mode
  • 6 to 40 kHz Pulse frequency
  • Can be used with 200 W in NIR

Synova Coupling Unit

  • Water jet diameter from 45 µm to 100 µm
  • Laminar length up to 8 cm
  • Water pressure 50 to 300 bar

Cutting performance

  • 0.1 mm stainless steel > 50 mm/s
  • 2 mm aluminum with approx. 0.2 mm/s
  • Cutting width 50 µm to 100 µm

4-Lambda laser system


EKSPLA Techno35C (DPSSL Nd:YVO4)

  • 15 W @ 1064 nm (IR)
  • 5.5 W @ 532 nm (green)
  • 3.5 W @ 355 nm (UV)
  • 0.7 W @ 266 nm (UV)

Repetition rate : 2.5 to 100 kHz

Pulse duration: 4 ns - 28 ns

Aerotech 3 axes linear drives up to 750 mm/s

Processing lenses with 50 mm focal length

  • Structure size: 10 µm - 20 µm

Raylase galvo scanner with 163 mm f-θ lens

Applications

  • Microstructuring, thinfilm ablation
  • Beam shaping (top hat) and beam splitting

Krf Excimer Laser – COHERENT bragg star industrial


Properties:

  • Wavelength: 248 nm
  • Max. Pulse energy: 16 mJ
  • Repetition rate: 1000 Hz
  • Raw beam size: 6 x 3 mm 2
  • Spatial coherence: 1500 µm

Application:

  • Modification of polymer materials
  • Manufacture of planar polymeric Bragg gratings

Laser Marker – Keyence YVO4-Hybrid-Marking Laser


Laser sources:

  • Wavelength: 1064 nm
  • Power: 13 W
  • Max. Repetition rate: 400 kHz

3D galvanometer scanner

  • Marking resolution: 2 µm
  • Scanning speed: 12 m/s
  • Marking rangef: 125 × 125 × 42 mm3


Laboratory Setups


Laser beam sources

  • Nd:YAG Laser: 1064 nm, 50 W
  • Nd:YAG Laser: 532 nm, 3,5 W
  • CO2 Laser: 10.6 µm, 200 W

Mask Alignment System – EVG 620 Mask Aligner


UV exposure for photolithography using a mercury vapor lamp

  • Lamp power: 350 W
  • Optional wavelength filters
  • Exposure Mode
    • Proximity
    • Soft- and Hard Contact
    • Vacuum Contact
  • Structure resolution: ≤ 2 µm (Proximity)
  • Casette system for different substrate sizes: 3", 4", 150 mm

UV-Nanoimprint-Lithography (UV-NIL) witch stamp possible

  • Structure resolution ≤ 50 nm
  • Exposure modes: Soft- and Vacuum-Contact

3D Laser Lithography System – Nanoscribe Photonic Professional GT


Laser

  • Erbium doped ultrashort pulse fiber laser
  • λ = 780 nm; P = 140 mW; Pl = 91 fs; RR = 80 MHz

Drives

  • Linear actuator
    • Travel path: 10 x 12 cm2
    • Feed rate: up to 500 µm/s
  • Piezo drive
    • Travel path: 300 x 300 µm2
    • Feed rate: up to 1000 µm/s
  • Galvanoscanner
    • Processing area: 200 x 200 µm 2
    • Feed rate: up to 200 mm/s
  • Writing performance
    • Line width: 120 nm (single lines)
    • Complete 3D structure creation

Low pressure plasma system – Diener Electronic Pico


System for reactive ion etching

  • 40 kHz Alternator
  • Power 0 - 230 W
  • Two Mass Flow Controllers
  • Pressure control range 0.01 - 1 mbar

Available Gases

  • Tetrafluormethan CF4
  • Sulphur hexafuoride SF6
  • Oxygen O2
  • Additional gases are possible

Applications

  • Anisotropic etching of PMMA to produce optical components
  • Anisotropic etching of SiO2

Sputter Coater – Leica EM SCD500


  • Sample size of fragments up to 3 inches
  • Layer thickness measurement using quartz crystal
  • Planetary gear to avoid shadow effects
  • Available materials: Gold, Chrome and Tungsten


Sputter Coater – Tectra SPUCO


  • Thermal evaporation
  • Electron beam vaporization
  • Sample size from fragments up to 3 inch wafers
  • Layer thickness measurement using quartz crystal

Spin Coater – Sawatec SM-180-BT


  • Sample size of fragments up to 6 inches
  • Rotation feed rate up to 10.000 rpm
  • 24 segments adjustable per spin operation
  • Semi-automatic photoresist dispensing system


Dip Coater – MTI WPTL5-0.01


  • Completely programmable
  • Acquisition of up to two samples and five coating materials
  • Temperature chamber
  • Sample dip travel path: up to 80 mm
  • Dip feed rate: 1 - 200 mm/min


Precision Picoliter Liquid Dispenser – Sonoplot Gix Microplotter II


Precise Picoliter Dispenser System

Liquid absorption by pure capillary force

  • Depostion volume > 0.6 pL
  • Suitable for liquids with a viscosity between 0 and 450 cP

Ultrasonic controlled contactless liquid deposition

  • Structure sizes from 5-200 µm

Positioning with XYZ linear drives

  • Processing area: 35 x 30 x 7 cm
  • Positioning accuracy: 5 µm

CAD supported creation of simple and complex structures



Calibration gas generator – QCAL Vapor Calibrator


Gas mixture production

  • Principle of pressure saturation According to DIN EN ISO 6145-9, VDI 3490-13
  • 2-stage system with saturator and capacitor
  • For targeted evaporation of liquids and solids with vapour pressure > 0.005 mmHg (20°C)

e.g. for sensitivity investigations of gas sensors

Variable setting of the analyte concentration during runtime

  • From the volume percentage range down to the lower ppm range (< 1ppm)

Variable carrier gas (usually nitrogen)


Temperature and Climate Test Cabinet – Weisstechnik WKL34


Temperature test: -40 - +180 °C

Temperature change:

  • Heating: 5.0 K/min
  • Cooling: 3.5 K/min

Temperature deviation:

  • Time: ±0,3 - ±1,0 K
  • Spatial: ±0,5 - ±2,0 K

Humidity range: 10 % - 98 % r.h.

Humidity deviation: ±1 - ±3 % r.h.

32-Bit-S!MPAC* control

3.5"TFT colour touch panel

psychometric humidity measuring system

USB and Ethernet interface


Sample preparation & post-processing


  • Precision Saw
  • Grinding & Polishing
  • Embedding equipment

Atomic force microscope – Bruker Dimension Icon


  • Scan range: 90 x 90 x 10 µm3
  • X-Y position noise: 0,10 nm
  • Z sensor noise: 35 - 50 pm
  • Sample size: ∅210 x 15 mm3
  • Acoustic isolation of the environment of up to 85 dB
  • Drift rates < 200 pm per minute for instant distortion-free images
  • Background noise < 30 pm due to closed-loop performance
  • Simultaneous imaging between nanomechanical properties and topography of the sample
  • Working range: 1 MPA - 50 GPA for module and 10 pN to 10 µN for adhesion
  • Electrical characterization
  • Nanomanipulation
  • Temperature analyses on samples form -35° C - +250° C

Scanning electron microscope – LOT-QuantumDesign Phenom Pro X


  • Magnification: 120x - 100.000x
  • Field of View: 2 mm - 2.7 µm
  • Resolution: 25 nm (7*7 Pixel)
  • Image loading time < 30 Sekuden
  • EDX element detection
  • Carbon (C/6) to americium (Am/95)
  • Samples up to ∅ 25 mm
  • Chargereduction for non-conductors
  • Tilt & Rotation for tilting angles up to 45°
  • Cooling Stage for temperatures from -25 °C to +25 °C

Raman microscope – WITec alpha300 R


  • Capture a full Raman spectrum at each image pixel
  • Planar scans in x-y axes as well as depth scans in z-
  • Depth profiles and Raman spectra at single points
  • Brightfield-, darkfield-, phasecontrast-microscopy and DIC
  • Confocal fluorescence microscopy
  • Sample size: 120 x 120 mm2

3D Laser Scanning Microscope – Keyence VK-X200


Topographic measurement

  • Complex surface profiles
  • Surface finisch according to JIS B0601:2201 (Iso 4287:1997)

Analysis of transparent layer thicknesses

Measurement window

  • max. 1350 µm x 1012 µm (at 10x)
  • min. 90µm x 67 µm (at 150x)
  • Up to 400 measuring windows can be combined to form an overall image

Microscope – Keyence VR3200


Topography measurement using the light section method

Macro Mode

  • Viewing range max. 24 x 18 x10 mm³
  • Height accuracy: ±3 µm
  • Lateral accuracy: ±5 µm

Micro Mode

  • Viewing area max. 7,6 x 5,7 x1 mm³
  • Height accuracy: ±3 µm
  • Lateral accuracy: ±2 µm

Measurement and analysis functions

  • Profile measurement (height, width, angle, radius)
  • Curvature, line roughness (ISO4287:1997)
  • Surface roughness (ISO 25178)

Optical 3D Scanner – GOM ATOS Core


  • Three-dimensional measurement of components up to 500 mm
  • Precise 3D coordinate measurement for form and dimension analysis
  • High-resolution polygon meshes (STL) for 3D printing, generative manufacturing and dimensional control
  • Combination of a strip light projector and two cameras for complete digitization of an object

Surface measuring instrument – FRT Microprof


Confocal microscope CFM

  • Contact-free 3D surface measurement
  • Structure, roughness and topography measurement
  • Light source LED 505 nm

Chromatic White Light Sensor CWL

  • Applicable on almost all surfaces
  • Measuring range 25 mm to 300 µm
  • Height resolution 250 nm to 3 nm
  • Lateral resolution 12.5 µm to 1 µm

White light interferometer – Bruker ContourGT-K


Optical 3D microscope for surface measurement

  • Maximum scanning range: >10 mm
  • RMS Repeatability: <0.03 nm
  • Maximum scanning speed: 47 µm / s
  • Sample size: 150 x 150 x 100 mm3
  • Sample weight: 4.5 kg
  • Sample reflectivity: 0,05 - 100 %
  • Sample inclination: 40° (glossy surfaces); 84° (rough surfaces)

Tactile profile meter – Bruker Dektak XT


Tactile surface and profile measurement

  • Texture
  • Roughness
  • Topography
  • Repeat accurcy vertical 4
  • Resolution vertical 1
  • Step height up to 1 mm
  • Measuring range 5 mm
  • X/Y Achse 150 mm * 150 mm
  • R-Theta-Axis 360°
  • Sample up to 200 mm
  • Sample thickness up to 50 mm

Microscope – Nikon LV100DA-U


Motorized microscope for reflected and transmitted light applications

  • Observation procedure:
    • Brightfield
    • Darkfield
    • Polarization
    • Differential interference
    • Incident light fluorescence
    • Two-beam interferometry
  • Maximum sample size: 150 x 150 x 38 mm3

Microscope – Leica DM6000


Microscope for Material Sciences

Objectives:

  • 5x, 10x, 20x, 50x, 100x
  • motorized nosepiece

observation modes

  • Brightfield
  • Darkfield
  • Polarization
  • Differential interference contrast

Documentation tube for Leica DFC295 digital camera to capture microscope images

LAS Leica Application Suite (PC software)

Touch-sensitive touch screen (Leica SmartTouch)


Digital microscope – Leica DMV6 a


Microscope for 3D visualization

Special features:

  • Tilting stand ±60°
  • Motorized table
  • 3D recording by z-stack measurements
  • Max. x-y measuring range
  • Stepless zoom optics
Objectives Working distance max. resolution
PlanAPO FOV 43.75 60 mm 1.2 µm
PlanAPO FOV 12.55 33 mm 0.47 µm

  • Horizontal working range: 110 mm x 80 mm
  • Working range vertical: approx. 120 mm
  • Sample weight max. 2 kg

Accessories: polarization filter, diffuser, transmitted light insert, inclination table


Stereomicroscope – Zeiss Stereo V8


  • Stereomicroscope for spatial impression of the samples
  • Reflected light microscope for non-transparent workpieces
  • 8x stepless zoom
  • 2 objectives (0,63 und 2,3)
  • Magnification max. 184x
  • Apochromatic stereo telescope system
  • Recording diameter 76 mm
  • LED Ring Light
  • Sliding table for flexible positioning
  • 1.4 Mega Pixel Camera
  • Software with measuring function

Hardness tester – Innovatest FALCON 5000


Determination of hardness according to Vickers (HV), Brinell (HB) and Rockwell (HRA, HRC, HRE)

  • Load range 10 g - 250 kg
  • Measurement of depth gradients (CHD) possible due to controllable table in x- and y-direction
  • Overview camera available for exact setting of impressions
  • Fully automatic evaluation by software possible

Tester for hardness measurement according to Shore D and micro Shore D

Materials:

  • Suitable for thermoplastics and thermosets
    (not suitable for alastomers → Shore A)

Shore D:

  • Minimum sample thickness of 6 mm

micro Shore D:

  • Minimum thickness of sample 0.5 mm
  • Standard: Barreis company

Accessories:

  • Calibration plates

Tensile Testing Machine – Shimadzu EZ-Test LX & AG-Xplus


Universal Test Stand Shimadzu EZ-Test LX

  • Backlash-free preloaded ballscrew
  • Drive via AC servo motor
  • Single column model with test stroke of 920 mm
  • Test speed: 0.05 to 1000 mm/min
  • 2 kN precision measuring cells for tensile and compressive force measurements
  • Automatic self-calibration (tension/compression)

Software functions:

  • Automatic determination of sample breaking with Auto-Stop
  • Free input of test parameters and test speed
  • Choice of strength or stress
  • Variable creation of test curves by free input

Universal testing machine Shimadzu AG-Xplus

  • Two-column model with a test chamber height of 700 mm
  • Test speed: 0.0005 - 3 000 mm/min (brittle materials - rubber)
  • Load cells from 0.01 N up to 600 kN for tensile and compression tests

Software functions:

  • Data transfer rate of 5 kHz (for brittle materials)
  • Automat. Determination of specimen break with Auto-Stop

Typical applications

  • Tensile and compression test (optional with extensometer)
  • Bending test (3-point, 4-point)
  • Pull-off test
  • Peel test

Dilatometer – Netzsch DIL 402 Expedis


Apparatus for determining linear expansion over different temperature ranges

  • Temperature: Tmax = 1150 °C
  • Heating rate: 0.001 - 50 K/min
  • Sample dimension: 12 mm, length either 25 oder 50 mm
  • Length resolution: 2 nm
  • Use of different gas atmospheres possible

Particle measuring device – Retsch Chamsizer X2


  • Determination of particle size distribution and particle shape by dynamic image analysis
  • Two-camera system according to ISO 13322-2
  • Particle size range 0.8 - 5 mm
  • Dry dispersion of the sample by compressed air nozzle
  • Measuring time 2-3 min

Tribometer – Bruker TriboLab


Universal tribometer for determining mechanical friction and wear properties

System configuration

  • Linear actuator
    • Stroke: 120mm
    • Feed rate: 10 mm/s
  • Rotary drive
    • 5000 rpm
    • Liquid container for permanent lubrication
  • Force sensor from 50 mN to 200 N
  • Temperature chamber up to 400 °C

Contact angle and drop shape analysis – DataPhysics OCA 25


  • Direct dosing system
  • Frame rate: 75 fps
  • Heating chamber for analysis up to 400 °C
  • Tilting device for measuring
    • Progress and retreat angles
    • Roll-off angle
    • Contact angle hysteresis

Optical Coherence Tomography – Thorlabs SD-OCR Callisto


Measuring system for optical coherence tomography (OCT)

  • SLD with λ = 930 nm and Δλ = 100 nm
  • Axial resolution of 7 µm
  • Lateral resolution of 8 µm
  • Maximum penetration depth of 1.6 mm

Applications

  • Material testing
  • Thin layer system (e.g. glued areas on packaging, enemal on ceramics, etc.)
  • Inclusions in material
  • multilayer systems
  • medical technology
  • examination of dental prostheses

Ellipsometer – Horiba Smartse


  • Characterization of thin layers (also multilayer)
  • Spectral range: 450 nm - 1000 nm with different spot sizes
  • Measuring time < 1 s - max. 10 s
  • Evaluation by ellipsometric odel analysis
  • Optical measurement:
    • Refractive index n
    • Extinction coefficient k
  • Layer thickness measurement from 2 to 20 m (±0,04 %)

Mode Line Spectroscopy – Metricon Model 2010/M


  • Refractive index and layer thicknesses of bulk material and thin layers measurable
  • Measurable refractive index < 1.8
  • Refractive index resolution: 0.003 - 0.0001 (sample dependent)
  • Layer thickness resolution: 5 nm
  • Wavelengths: 637 nm, 830 nm, 1311 nm, 1548 nm
  • optimal TE and TM measurement

Applications:

  • Optical characterization of planar optical fibers
  • Optical characterization of thin films (photoresists, etc.)
  • Measurement of single and double layer systems

Abbe Refractometer – Atago DR-M2


  • Measurement of liquids and solids
  • Available wavelengths
    • 486 nm (wavelength to determine the Abbe number)
    • 589 nm (standard wavelength)
    • 644 nm (wavelength to determine the Abbe number)
    • 656 nm (wavelength to determine the Abbe number)
    • 810 nm (first optical window)
    • 1300 nm (second optical window)
    • 1550 nm (third optical window)
  • Measurable refractive index range from 1.3000 to 1.7100 at 589 nm
  • Measuring accuracy ± 0.0002
  • IR measurements are possible

Bragg grating characterization– Stratophase SYS:Lab 1 & 2


  • Online detection and tracking of reflected wavelengths
  • Wavelenngth range
    • 1510 nm - 1590 nm
  • Sampling rate: 1 Hz / 2 Hz
  • Resolution: 1 pm
  • Max. number of sensors: 2 / 4
  • Ports: FC/APC
  • Touchscreen operation
  • Control of fluidic pumps
  • Integrated software for online tracking of up to ten reflected wavelengths per sensor
  • External fluidic system with 4 pumps of different volumes

Optical measurement technology


  • Transmission and reflection
  • LED measuring sytem

Laser beam diagnostics


  • APE Pulse Check 50
  • Prime Polarization Analyzer
  • Primes Focus Monitor
  • Thorlabs - Shack Hartmann Sensor


Selective laser melting system – EOS M 290


Production of complex structures of metal components directly from CAD files for feasibility studies, prototypes and small series with integrated monitoring system for quality assurance.

Characteristics

  • Laserpower: 400 W
  • Wavelength: 1070 nm
  • Focus diameter: 100 µm
  • Scanning speed: max. 7.0 m/s
  • Building volume: 250 x 250 x 325 mm3

Materials

  • Stainless steel
  • Titanium
  • Aluminium
  • Nickel alloys
  • and much more

Selective laser sintering system – EOS FORMIGA P 110


3D printing of fully functional, detailed and biocompatible polymer components.

Characteristics

  • Laserpower: 30 W
  • Wavelength: 10.6 µm
  • Scanning speed: max. 5.0 m/s
  • Construction volume: 200 x 250 x 330 mm3

Supported materials

  • Polyamide
  • Alumide
  • PrimeCast® 101
  • PrimePart® ST

Hybrid milling and laser melting system – Matsuura LUMEX


  • Combination of selective laser sintering (SLS) and high speed milling (HSM)
  • This combination reduces both roughness and rework times to a minimum.

Laser

  • Laserpower: 50 - 500 W
  • Laser beam quality: M2 < 1,1
  • Wavelength: 1070 nm

Tools

  • Spindle speed: 450 - 45.000 min-1
  • Drive power: 4,5 / 2,6 kW
  • Number of spindles: 20

Supported metals

  • Stainless steel 630 / 316L
  • Titanium alloy Ti-6Al-4V
  • Cobalt chromium superalloy
  • Nickel alloy 718
  • AlSi10Mg

Hot isostatic press – Quintus QIH


  • Compression of materials (e.g. additive manufactured bodies) at high heat and gas pressure.
  • The HIP process produces a density of 100% at a temperature far below the solidus temperature of the specific material.
  • Maximum operating pressure: 2070 bar
  • Maximum temperature: 1400 °C
  • Processing chamber: ∅ 170 mm2 x 300 mm

Selective Laser Melting System – Realizer SLM-300i


Processing of tool steel, stainless steel, Ni alloys, Al alloys, titanium, titanium alloys, CoCr alloys and other weldable alloys

Characteristics:

  • 1000 W fiber laser
  • Accuracy z-direction: 20 - 100 µm
  • Platform dimensions: 300 x 300 mm
  • Maximum construction height: 300 mm

Integrated sieve station for powder recycling

Modular powder trolley for docking


Selective Laser Melting System – Realizer SLM-50


Processing of tool steel, stainless steel, Ni alloys, Al alloys, titanium, titanium alloys, CoCr alloys and other weldable alloys

Characteristics:

  • 100 W fiber laser
  • Accuracy z-direction 20 - 50 µm
  • Platform Dimension: 70 mm
  • Maximum construction height: 80 mm

3D Printer – Stratasys Fortus 450mc


Fused Deposition Modelling

Processing of standard thermoplastics (ABS), engineering thermoplastics (nylon, PC) and high-performance thermoplastics (Ultem 1010 and 9085)

Characteristics:

  • Processing space: 40.6 x 35.5 x 40 cm3
  • Support: break-away und wasserlöslich
  • Device for two support canisters and model cartridges
  • Layer thicknesses: 0.127 - 0.330 nm

Colour and multi-materials 3D printing – Stratasys Objet350 Connex3


Processing of digital ABS, biocompatible plastic, high temperature material, rubber-like material and polypropylene-like material.

Characteristics:

  • Processing space: 340 x 340 x 200 mm3
  • Layer thickness: 16 - 30 µm
  • Processing of up to three materials simultaneously
  • Variations:
    • Degrees of hardness
    • Transparency
    • Flexibility
    • Colors
    • Temperature stability